Silicone Thermal Grease, 2-10 W/m·K

Thermal Grease: Extreme Temperature Resistance and Low Thermal Resistance Gap Filling

The thermal grease (silicone-based) from Lixing Composite Materials offers high thermal conductivity, low thermal impedance, excellent insulation and stable working performance. It suits the heat dissipation needs of all kinds of electronic components, with a wide operating temperature range from -40°C to 250°C and momentary temperature resistance from -50°C to 340°C.

Product Features

Efficient heat transfer: Available in multiple grades from 2-10 W/m·K, with very low thermal impedance for rapid heat transfer.
Outstanding temperature resistance: Stable operating temperature from -40°C to 250°C, with momentary resistance up to 340°C.
High-grade insulation: Volume resistivity of 10^14 Ohm-cm keeps precision circuits safe and prevents any current leakage.
Stable and non-flowing: High viscosity and extremely low evaporation; it does not dry out, crack or fail under long-term high temperature.

Technical Specifications

Item	Specification	Unit	Test Method
Color	Grey	—	Visual
Thermal Conductivity	2 – 10	W/m·K	ASTM D5470
Thermal Impedance	< 0.126	°C-in²/W	ASTM D5470
Specific Gravity	2.3 – 2.9	g/cm³	ASTM D792
Evaporation	< 0.001	g	Evaporation monitor
Volume Resistivity	10^14	Ohm-cm	ASTM D257
Viscosity	Non-flowing	Pa.s	Brookfield
Momentary Temperature	-50 ~ 340	°C	—
Operating Temperature	-40 ~ 250	°C	—

Applications

Core computing components: Thermal gap filling for CPUs, GPUs and high-power server chips.
Power electronics: Widely used as the thermal interface between diodes, transistors and power modules and their heat sinks.
Automotive and aerospace electronics: Meets the cooling needs of precision electronics operating under extreme temperature swings.
Consumer electronics: Improves thermal management in laptops, game consoles and high-power LED lighting.

Thermal Grease in Summary: High-End Thermal Management

In short, Lixing’s silicone-based thermal grease delivers high thermal conductivity, low thermal impedance, excellent insulation and stable performance for the heat dissipation needs of a wide range of electronic components, operating from -40°C to 250°C and tolerating momentary excursions from -50°C to 340°C.

[Product Features]

High Thermal Conductivity: Grades from 2-10 W/m·K with ultra-low thermal impedance for rapid heat transfer.
Extreme Temperature Resistance: Operates from -40°C to 250°C and withstands momentary peaks up to 340°C.
Superior Electrical Insulation: 10^14 Ohm-cm volume resistivity protects precision circuits and prevents leakage.
Stable & Non-flowing: High viscosity and extremely low evaporation; will not crack or fail under long-term high temperatures.

[Technical Specifications]

Item	Specification	Unit	Test Method
Color	Grey	—	Visual
Thermal Conductivity	2 – 10	W/m·K	ASTM D5470
Thermal Impedance	< 0.126	°C-in²/W	ASTM D5470
Specific Gravity	2.3 – 2.9	g/cm³	ASTM D792
Evaporation	< 0.001	g	Evaporation Monitor
Volume Resistivity	10^14	Ohm-cm	ASTM D257
Viscosity	Non-flowing	Pa.s	Brookfield
Momentary Temp.	-50 ~ 340	°C	—
Operating Temp.	-40 ~ 250	°C	—

[Applications]

Core Computing: Thermal interfaces for CPUs, GPUs and high-performance server chips.
Power Electronics: Diodes, transistors and power modules, between the component and the heat sink.
Automotive & Aerospace: Reliable cooling performance through extreme temperature fluctuations.
Consumer Electronics: Better heat management for laptops, gaming consoles and high-power LED lighting.