Thermal Pad: Efficient Gap Filling and Superior Cushioning for Thermal Management
In the thermal management design of high-performance computing and power electronics, the thermal pad is a key interface material for eliminating thermal resistance and improving heat-exchange efficiency. The thermal pad series from Lixing Composite Materials offers excellent softness, elasticity and high compressibility, effectively filling the tiny air gaps between heat-generating components and heat-sink modules to ensure the stability and safety of electronic products under high loads.
Why Choose Lixing Thermal Pads?
Ultra-soft with high compressibility: With a hardness of only 5 to 40 Shore B, the pad compresses substantially under very low pressure and conforms closely to uneven surfaces, maximizing contact area.
Wide choice of thermal conductivity: Multiple grades from 1.0 W/m·K to 10.0 W/m·K precisely match heat-dissipation needs from consumer electronics to high-power industrial equipment.
Excellent insulation and flame retardancy: Meets the UL 94 V-0 / V-1 flame rating and provides reliable electrical insulation, keeping precision circuits safe.
Vibration damping and protection: The material also cushions well, absorbing mechanical vibration and protecting fragile electronic parts from pressure damage.
Full customization service: Thicknesses from 0.25mm to 1.3mm, with precision die-cutting to customer drawings or convenient roll supply.
Technical Parameters
| Item | Parameter |
| Product Name | Thermal Pad |
| Thermal Conductivity | 1.0 ~ 10.0 W/m·K (select by grade) |
| Hardness | 5 Shore B ~ 40 Shore B (ultra-soft) |
| Thickness Range | 0.25mm ~ 1.3mm |
| Operating Temperature | -40°C to 200°C |
| Flame Rating | UL 94 V-0 / V-1 |
| Withstand Voltage | < 4kV |
| Specific Gravity / Density | 1.5 ~ 2.0 g/cm³ |
| Customization | Color, size, shape and tackiness adjustments |
Applications
Core computing components: Widely used for CPU and GPU cooling, effectively lowering chip operating thermal resistance.
Thermal modules: Serves as a high-efficiency thermal interface between thermal modules and metal chassis or housings.
Power and energy systems: Thermal management for power supplies and high-power LED lighting applications.
Telecom and automotive electronics: Stable thermal conduction and cushioning protection for 5G communications equipment and automotive power components.
Thermal Pad / Silicone Gap Pad: Premium Solution for GAP Filling
In the thermal management design of high-performance computing and power electronic equipment, the Thermal Pad is a critical interface material for eliminating thermal resistance and enhancing heat exchange efficiency. The thermal pad series provided by Lixing features exceptional softness, elasticity, and high compressibility, effectively filling micro air gaps between heat-generating components and cooling modules to ensure the stability and safety of electronic products in high-load environments.
[Why Choose Our Thermal Pad?]
Extreme Softness & High Compressibility: Hardness ranges from only 5 to 40 Shore B, allowing for high compression under very low pressure to conform perfectly to uneven surfaces and maximize contact area.
Wide Range of Thermal Performance: Available in multiple grades from 1.0 W/m·K to 10.0 W/m·K, accurately meeting the heat dissipation requirements of various electronic devices.
Superior Insulation & Fire Resistance: Complies with the UL 94 V-0 / V-1 highest flame-retardant rating and provides reliable electrical insulation to ensure the safety of precision circuits.
Vibration Damping & Protection: The material provides an excellent cushioning effect, absorbing mechanical vibrations and protecting fragile electronic components from pressure damage.
Comprehensive Customization: Supports thicknesses from 0.25mm to 1.3mm, with options for precision die-cutting based on customer drawings or convenient roll supply.
[Technical Specifications]
| Item | Parameter |
| Product Name | Thermal Pad / Silicone Gap Pad |
| Thermal Conductivity | 1.0 ~ 10.0 W/m·K (Grade dependent) |
| Hardness | 5 Shore B ~ 40 Shore B (Ultra-soft) |
| Thickness Range | 0.25mm ~ 1.3mm |
| Temp. Resistance | -40°C to 200°C |
| Flame Resistance Rating | UL 94 V-0 / V-1 |
| Withstand Voltage | < 4kV |
| Proportion (Density) | 1.5 ~ 2.0 g/cm³ |
| Customization | Color, Size, Shape, and Adhesive requirements |
[Applications]
Core Computing: Widely used for CPU and GPU cooling to effectively reduce chip thermal resistance.
Thermal Modules: Acts as a high-efficiency thermal interface between cooling modules and metal chassis or casings.
Power & Energy Systems: Suitable for thermal management in power supplies and high-power LED lighting applications.
Telecommunications & Automotive: Provides stable thermal conduction and cushioning protection for 5G equipment and automotive power components.
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