立興高溫耐壓緩衝墊：PCB 與 IC 載板精密壓合的卓越方案
LIXING High-Temperature Press Cushion Pad: Solution for PCB & IC Substrate Lamination
在現代電子產業的高階製程中，高溫耐壓緩衝墊已成為提升產品質量的關鍵耗材。立興複合材料研發的這款產品，採用了先進的鐵氟龍（Teflon）奈米塗層技術作為防黏層，能在極端環境下維持優異性能。
為什麼選擇立興高溫耐壓緩衝墊？ / Why Choose Our Press Cushion Pad?
這款高溫耐壓緩衝墊的內部結構極為精密，由氟樹脂高彈性纖維布、耐高溫高導熱氟樹脂及高拉力纖維布等多層複合而成。 經奈米離型處理後，它能解決傳統壓合製程中的諸多痛點：
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卓越耐溫性能：可在高達 280°C 的環境下穩定運作。
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極致抗壓強度：抗壓能力超過 45 Kg/cm²，確保壓合受力均勻。
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取代傳統方案：是取代傳統牛皮紙與矽膠墊的理想方案，具備防粘連且可重複使用的特點。
技術規格與應用 / Technical Specifications & Applications
針對 PCB、FPC、軟硬結合板及 IC 載板等精密壓合需求，我們的高溫耐壓緩衝墊提供以下專業參數：
| 項目 (Item) | 參數值 (Value) |
| 硬度 (Hardness) | 85 – 90 Shore A |
| 耐溫 (Temperature) | 280°C |
| 抗壓 (Pressurization) | > 45 Kg/cm² |
| 使用壽命 (Life Times) | 約 600 次 |
| 防黏層 (Surface) | 鐵氟龍奈米塗層 (Teflon Nano-coating) |
完善的壓合解決方案組合 / Complete Lamination Solution
為了達到最佳的壓合效果，建議將此高溫耐壓緩衝墊搭配立興的其他核心產品使用：
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燒付鐵板 (Silicone Iron Pad)：提供結構支撐與均溫效果。
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FPC 綠色矽膠墊 (FPC Green Cushioning Pad)：強化局部壓力補償。
欲瞭解更多關於電路板製程的國際標準，請參考 IPC 國際電子電路標準組織 的官方規範。
LIXING High-Temperature Press Cushion Pad: Premium Lamination Solution for PCB & IC Substrates
The High-Temperature Press Cushion Pad is an essential consumable for high-end manufacturing in the modern electronics industry. Developed by Lixing Composite Material, this High-Temperature Press Cushion Pad utilizes advanced Teflon (PTFE) nano-coating technology as an anti-stick layer, ensuring stable performance under extreme processing conditions. It is the ideal long-term solution to replace traditional kraft paper and silicone pads in precision lamination.
Why Choose the LIXING High-Temperature Press Cushion Pad?
The internal structure of this High-Temperature Press Cushion Pad is engineered with multiple layers, including high-elastic PTFE fiber fabric, high-temperature heat-conductive fluororesin, and high-tensile fiberglass cloth. By integrating a nano-release coating, it effectively addresses common pain points in the lamination process:
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Extreme Temperature Resistance: This High-Temperature Press Cushion Pad operates stably in environments up to 280°C.
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Superior Pressure Durability: With a pressurization capacity exceeding 45 Kg/cm², it ensures uniform pressure distribution during lamination.
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Sustainable Efficiency: Designed as a reusable alternative to kraft paper, it offers non-stick properties and a significantly longer service life, reaching approximately 600 cycles.
Technical Specifications & Applications
Our High-Temperature Press Cushion Pad is specifically designed for the lamination of PCBs, FPCBs, Rigid-Flex boards, IC substrates, HDI, and high-frequency/high-speed boards.
| Item | Specification Value |
| Hardness | 85 – 90 Shore A |
| Working Temperature | 280°C |
| Pressurization | > 45 Kg/cm² |
| Service Life | Approx. 600 cycles (Depending on process) |
| Surface Coating | Teflon Nano-coating |
Integrated Lamination Solutions
To achieve the highest production yields, we recommend using the High-Temperature Press Cushion Pad in combination with Lixing’s core product suite:
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Silicone Iron Pads (Lamination Steel Pads): For structural support and even heat distribution.
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FPC Green Cushioning Pads: For enhanced local pressure compensation.
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PTFE (Teflon) Film Tapes & Polyimide Tapes: For edge protection and high-temp insulation.
For further technical standards regarding circuit board manufacturing, please refer to the IPC (Association Connecting Electronics Industries) official guidelines.
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