綠色矽膠墊：熱壓製程均溫與高精密緩衝的卓越方案
在電子製造與 FPC 軟性電路板壓合製程中，綠色矽膠墊是達成均勻傳熱與壓力釋放的關鍵媒介。立興複合材料提供的綠色矽膠墊，結合高品質矽膠與玻璃纖維結構，具備優異的耐高溫、耐高壓與絕緣性能，能有效提升產品良率並延長生產設備的使用壽命。
【為什麼選擇立興綠色矽膠墊？】
優異的導熱與均溫性：矽膠層能使熱度均勻分佈於表面，避免局部過熱或燙傷發生，確保壓合品質穩定。
卓越的緩衝與耐壓：具備強大的彈性與緩衝性能，能有效分散熱壓機壓力，防止操作材料受損。
高重複使用與長壽命：正常操作條件下使用壽命可達 2,000 至 3,000 次，降低耗材汰換頻率，節省生產成本。
抗靜電與絕緣防護：具備優良的耐電壓特性與抗靜電性能，適用於各類敏感電子零件固定與遮蔽。
全方位的客製化服務：長度、寬度、厚度與硬度皆可依製程需求調整，並支援貼背膠加工、卷材或精密沖型出貨。
【技術參數表】
| 項目 (Item) | 規格參數 (Specification) | 備註 (Note) |
| 產品名稱 | 綠色矽膠墊 (Green Silicone Pad) | — |
| 材質組成 | 矽膠 + 玻璃纖維 (Silicone + Glass Fiber) | — |
| 比重 (密度) | 1.3 ± 0.2 g/cm³ | — |
| 撕裂強度 | > 70 kgf/cm² | — |
| 延伸率 | 380% ± 10% | — |
| 硬度 | 50 HA ± 5 HA | — |
| 玻纖厚度 | 0.2 ± 0.02 mm | — |
| 耐溫性能 | 200°C | — |
| 建議溫度 | 175°C ～ 195°C | — |
| 使用壽命 | 約 2,000 ～ 3,000 次 | 視操作條件而異 |
Green Silicone Pad: Premium Solution for Thermal Conductivity & Buffering
In the electronic manufacturing and FPC (Flexible Printed Circuit) lamination processes, the Green Silicone Pad is a critical medium for achieving uniform heat transfer and pressure release. The Green Silicone Pad provided by Lixing Compound Material combines high-quality silicone with a glass fiber structure, offering excellent high-temperature resistance, high-pressure endurance, and superior insulation properties, effectively improving product yield and extending the lifespan of production equipment.
[Why Choose Our Green Silicone Pad?]
Optimized Heat Transfer: The silicone layer ensures heat is distributed evenly across the surface, preventing localized overheating or burns and ensuring consistent lamination quality.
Superior Elasticity & Buffering: Features strong elastic and cushioning properties that effectively distribute hot press pressure, protecting operational materials from damage.
High Reusability & Durability: Under normal operating conditions, the service life can reach 2,000 to 3,000 cycles, reducing the frequency of consumable replacement and lowering costs.
Anti-static & Insulation Protection: Equipped with excellent voltage resistance and anti-static performance, suitable for securing and shielding sensitive electronic components.
Comprehensive Customization: Length, width, thickness, and hardness can all be adjusted to meet specific process requirements. Supports adhesive backing, roll form, or precision die-cut shipping.
[Technical Specifications]
| Item | Specification | Note |
| Name | Green Silicone Pad | — |
| Composition | Silicone + Glass Fiber | — |
| Density | 1.3 ± 0.2 g/cm³ | — |
| Peel Strength | > 70 kgf/cm² | — |
| Elongation | 380% ± 10% | — |
| Hardness | 50 HA ± 5 HA | — |
| GF Thickness | 0.2 ± 0.02 mm | — |
| Temp Resistance | 200°C | — |
| Operating Temp | 175°C – 195°C | — |
| Service Life | Approx. 2,000 – 3,000 times | Depending on conditions |
[Notice & Maintenance]
Installation: Ensure the hot plate surface is flat and free of scratches before installation. Install the pad as flatly as possible to the heating surface for optimal adhesion.
Handling: Avoid sharp bending to prevent material deformation or structural damage to the internal fiberglass.
Temperature Optimization: Recommended operating temperature is 160–250°C. Using lower temperatures within this range can significantly extend the product’s service life.
Silicone tube 矽膠管
Thermal conductive materials 導熱矽膠材料
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