鎳碳雙色複合導電矽膠密封條:外層鎳碳材質的卓越屏蔽方案
Nickel-Graphite Co-extruded Conductive Silicone Gasket: High-Performance Shielding
在高端通訊與軍規電子設備中,材料的電磁屏蔽穩定性至關重要。立興複合材料研發的 鎳碳雙色複合導電矽膠密封條,外層採用高品質 鎳碳 (Nickel-Graphite) 導電材質,透過共擠工藝與高彈性非導電矽膠層完美結合。這款產品不僅提供穩定的導電性,更具備優異的環境密封保護。
為什麼選擇立興鎳碳導電矽膠密封條? / Why Choose Our Nickel-Graphite Gasket?
鎳碳材質能確保密封條在各種頻段下皆具備極佳的屏蔽效果,並解決傳統導電材料的壽命問題:
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外層鎳碳材質 (Nickel-Graphite Layer):提供極佳的導電穩定性與優異的電磁屏蔽 (EMI Shielding) 效能。
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高彈性矽膠密封 (Water Seal):內層高彈性非導電矽膠確保卓越的水汽密封性能與力學強度。
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極低接觸阻抗:體積電阻率穩定維持在 ≤ 0.1 Ω·cm,確保高效能電氣連接。
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耐腐蝕與長壽命:鎳碳塗層具備優異的耐霉菌與鹽霧腐蝕性,適合嚴苛的戶外應用環境。
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優化的壓縮性能:與傳統導電產品相比更易壓縮且易於安裝,可依需求客製化各種截面形狀。
技術參數與屏蔽效能 / Technical Specifications
針對精密通訊設備與軍標等級應用,我們提供以下專業數據:
| 測試項目 (Item) | 單位 (Unit) | 典型數值 (Value) | 參照標準 (Standard) |
| 產品材質 (Material) | — | 外層鎳碳 / 內層矽膠 | — |
| 體積電阻 (Volume Resistivity) | Ω·cm | ≤ 0.1 | MIL-G-83528 |
| 硬度 (Hardness) | Shore A | 65 ± 5 | GB 531-81 |
| 比重 (Specific Gravity) | — | 2.0 ± 0.25 | ASTM D792 |
| 拉伸強度 (Tensile Strength) | MPa | 1 | GB 528-82 |
| 扯斷伸長率 (Elongation) | % | 70 | GB 528-82 |
| 撕裂強度 (Tear Strength) | KN/m | 5 | ASTM D624 |
| 壓縮永久形變 (70hrs x 100°C) | % | ≤ 32 | ASTM D395 |
| 連續使用溫度 (Continuous Temp) | °C | 160 | — |
屏蔽效能 (Shielding Effectiveness – Nickel Graphite Layer)
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200 KHz (H場):≥ 50 dB
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100 MHz (E場):100 dB
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2 GHz (平面波):90 dB
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10 GHz (平面波):80 dB
Nickel-Graphite Co-extruded Conductive Silicone Gasket
The Nickel-Graphite Co-extruded Conductive Silicone Gasket by Lixing is engineered for high-end applications requiring maximum EMI shielding effectiveness. By integrating an outer Nickel-Graphite conductive layer with a high-elasticity non-conductive silicone core, this gasket provides a dual-action solution for both electromagnetic interference and environmental challenges.
Key Highlights
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High-Grade Nickel-Graphite Material: Delivers robust conductivity and reliable shielding across a wide frequency spectrum.
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Integrated Environmental Seal: The high-resilience silicone core ensures a long-lasting moisture and dust seal.
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Superior Chemical Bonding: Advanced extrusion technology creates a strong bond between layers, preventing delamination in the field.
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Versatile Customization: Tailored profiles are available to suit specific shielding and sealing requirements in industrial and telecommunication sectors.



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