Name: 雙組份導熱封灌膠(Thermal Conductive Silicone Encapsulant)
SKU: H-FG-GY
Rating: 3.00 (2 reviews)

雙組份導熱灌封膠：高效熱管理與電子元件防護的卓越方案

H-GF-GY 雙組份導熱灌封膠是一種高導熱阻燃性雙組份加成型有機矽導熱灌封膠，可室溫固化，也可加熱固化（溫度越高固化越快）。其優異的柔性與彈性特徵，能完美覆蓋不平整表面，將熱量從 PCB 或分離器件傳導至金屬外殼，顯著提高發熱組件的效率與壽命。

【為什麼選擇立興導熱灌封膠？】

高效傳熱與穩定性：高導熱係數確保傳熱迅速，有效解決電子器材積熱問題。
優異的工藝性能：具備自粘接性能，無需底塗液；固化後可掰開，易於元器件修復。
強大的環境耐受力：具備卓越的絕緣、防水、耐氣候老化及耐高低溫性能。
防火安全保障：符合 UL 94 V-0 最高阻燃等級，確保電子產品運行安全。

【技術參數表 / Technical Parameters】

1. 固化前與操作性能 (Pre-Curing & Operating)

性能指標	參數/數值	測試標準
外觀顏色 (A組分)	白色流體	目視
外觀顏色 (B組分)	灰色流體	目視
混合比例 (A:B)	1 : 1 (重量比)	—
組分粘度 (A/B)	30,000 cps	ASTM D2196
可操作時間	40 ~ 60 min (@25°C)	—
固化時間 (室溫)	480 min (@25°C)	—
固化時間 (加熱)	20 min (@80°C)	—

2. 固化後技術參數 (Post-Curing)

性能指標	參數指標	測試標準
導熱系數	1.0 / 3.0 W/m·K	ISO 22007-2
產品硬度	55 ± 5 Shore A	ASTM D2240
產品比重	3.0 g/cm³	ASTM D792
抗拉強度	1.2 Mpa	ASTM D412
耐電壓強度	10 KV/mm	ASTM D149
體積電阻率	1 * 10^13 Ω·cm	ASTM D257
介電常數	5.0 (@1MHz)	ASTM D150
阻燃性能	V-0	UL 94

【使用工藝與注意事項】

攪拌混合：混合前將 A、B 膠分別攪拌均勻，按 1:1 重量比配比，誤差勿超過 3% 以免影響固化性能。
灌注脫泡：將混合膠料灌入器件，一般可不抽真空。若需極高導熱性，建議真空脫泡後再灌注。
固化條件：冬季室溫固化慢，建議採用 80°C 加熱固化 (15-30分鐘)，室溫則需約 6-8 小時。
環境影響：環境溫度較高時，混合後的操作適用期會相對縮短。

Thermal Conductive Silicone Encapsulant: Premium Solution for Electronic Protection

The H-GF-GY Thermal Conductive Encapsulant is a high thermal conductivity, flame-retardant, two-component addition-cure silicone. It can be cured at room temperature or accelerated by heat. Its flexibility and elasticity allow it to cover uneven surfaces, conducting heat from PCB components to the outer casing, thereby significantly improving the efficiency and service life of high-power devices.

[Why Choose Our Silicone Encapsulant?]

High Thermal Efficiency: Fast heat transfer ensures rapid cooling of sensitive electronic devices.
Process Flexibility: Self-adhesive properties eliminate the need for primers; cured material can be pried open for easy component repair.
Robust Protection: Features excellent insulation, waterproofing, and weather resistance against extreme temperatures and aging.
Certified Safety: Complies with UL 94 V-0 flame retardancy for maximum safety standards.

[Technical Specifications]

1. Pre-Curing & Operating Performance

Performance Indicators	Specification	Test Standard
Appearance (Part A)	White Fluid	Visual
Appearance (Part B)	Gray Fluid	Visual
Mix Ratio (A:B)	1 : 1 (by Weight)	—
Viscosity (A/B)	30,000 cps	ASTM D2196
Operable Time	40 ~ 60 min (@25°C)	—
Curing Time (RT)	480 min (@25°C)	—
Curing Time (Heat)	20 min (@80°C)	—

2. Post-Curing Technical Parameters

Performance Indicators	Specification	Test Standard
Thermal Conductivity	1.0 / 3.0 W/m·K	ISO 22007-2
Hardness	55 ± 5 Shore A	ASTM D2240
Specific Gravity	3.0 g/cm³	ASTM D792
Tensile Strength	1.2 Mpa	ASTM D412
Dielectric Strength	10 KV/mm	ASTM D149
Volume Resistivity	1 * 10^13 Ω·cm	ASTM D257
Dielectric Constant	5.0 (@1MHz)	ASTM D150
Flame Retardant	V-0	UL 94

[Usage Instructions & Applications]

Mixing: Stir components A and B separately before mixing. Maintain a 1:1 weight ratio within a 3% error margin to ensure proper curing.
Degassing: Vacuum degassing is recommended before pouring if the highest thermal performance is required.
Curing: Heating to 80°C for 15-30 minutes is recommended in winter or for fast production cycles.
Applications: Ideal for high-power LED lamps, power supplies, transformers, sensors, coils, and general electronic component protection.