Name: 導熱硅酯(導熱膏)(Thermal Grease)
SKU: H-TP-WH
Rating: 3.50 (2 reviews)

導熱膏：極限耐溫與低熱阻填充的卓越方案

珠海立興複合材料有限公司的導熱膏（矽膠基底）具有高導熱性、低熱阻抗、優異的絕緣性和穩定的工作性能。適用於各種電子元件的散熱需求，工作溫度範圍廣，從 -40°C 到 250°C，瞬間耐溫可達 -50°C 至 340°C。

【產品特點】

高效熱傳導：提供 2-10 W/m-K 多種等級選擇，具備極低熱阻抗，能迅速轉移熱量。
卓越耐溫性：工作溫度穩定於 -40°C 至 250°C，瞬間耐溫更高達 340°C。
高規格絕緣：體積電阻達 10^14 Ohm-cm，確保精密電路運作安全，絕不發生漏電。
穩定不流動：具備高粘度特性且蒸發量極低，長期高溫下不乾裂、不失效。

【技術參數表】

項目	參數指標	單位	測試方法
顏色	灰色 (Grey)	—	目視
熱傳導係數	2 – 10	W/m-K	ASTM D5470
熱阻抗	< 0.126	°C-in²/W	ASTM D5470
比重	2.3 – 2.9	g/cm³	ASTM D792
蒸發量	< 0.001	g	蒸發量監測儀
體積電阻	10^14	Ohm-cm	ASTM D257
粘度	不流動	Pa.s	Brookfeld
瞬間耐溫	-50 ~ 340	°C	EN 344
工作溫度	-40 ~ 250	°C	EN 344

【應用領域】

核心運算元件：適用於 CPU、GPU 與高功率伺服器晶片的散熱填充。
電力電子設備：廣泛應用於二極體、三極體及功率模組與散熱板間的導熱介面。
車用與航太電子：滿足在極端溫差環境下工作的精密電子散熱需求。
消費性電子：提升筆電、遊戲主機及高功率 LED 照明設備的熱管理效能。

Thermal Grease: Premium Solution for High-End Thermal Management

Zhuhai Lixing Compound Material Co., Ltd.’s thermal grease (Silicone-based) offers high thermal conductivity, low thermal impedance, excellent insulation, and stable performance. It is suitable for various electronic components’ heat dissipation needs, with an operating temperature range from -40°C to 250°C and momentary temperature resistance from -50°C to 340°C.

[Product Features]

High Thermal Conductivity: Offers various grades from 2-10 W/m-K with ultra-low thermal impedance for rapid heat transfer.
Extreme Temperature Resistance: Stable operating temperature from -40°C to 250°C, with momentary resistance up to 340°C.
Superior Electrical Insulation: Volume resistivity of 10^14 Ohm-cm ensures safety for precision circuits and prevents leakage.
Stable & Non-flowing: Features high viscosity with extremely low evaporation; will not crack or fail under long-term high temperatures.

[Technical Specifications]

Item	Specification	Unit	Test Method
Color	Grey	—	Visual
Thermal Conductivity	2 – 10	W/m-K	ASTM D5470
Thermal Impedance	< 0.126	°C-in²/W	ASTM D5470
Specific Gravity	2.3 – 2.9	g/cm³	ASTM D792
Evaporation	< 0.001	g	Evaporation Monitor
Volume Resistivity	10^14	Ohm-cm	ASTM D257
Viscosity	Non-flowing	Pa.s	Brookfeld
Momentary Temp.	-50 ~ 340	°C	EN 344
Operating Temp.	-40 ~ 250	°C	EN 344

[Applications]

Core Computing: Ideal for CPU, GPU, and high-performance server chip thermal interfaces.
Power Electronics: Widely used for diodes, transistors, and power modules between components and heat sinks.
Automotive & Aerospace: Reliable cooling performance in extreme temperature fluctuations.
Consumer Electronics: Enhances heat management for laptops, gaming consoles, and high-power LED lighting.