立兴高温耐压缓冲垫：PCB 与 IC 载板精密压合的卓越方案
LIXING High-Temperature Press Cushion Pad: Solution for PCB & IC Substrate Lamination
在现代电子产业的高端制程中，高温耐压缓冲垫已成为提升产品质量的关键耗材。立兴复合材料研发的这款产品，采用了先进的铁氟龙（Teflon）纳米涂层技术作为防黏层，能在极端环境下维持优异性能。
为什么选择立兴高温耐压缓冲垫？ / Why Choose Our Press Cushion Pad?
这款高温耐压缓冲垫的内部结构极为精密，由氟树脂高弹性纤维布、耐高温高导热氟树脂及高拉力纤维布等多层复合而成。 经纳米离型处理后，它能解决传统压合制程中的诸多痛点：
卓越耐温性能：可在高达 280°C 的环境下稳定运作。
极致抗压强度：抗压能力超过 45 Kg/cm²，确保压合受力均匀。
取代传统方案：是取代传统牛皮纸与硅胶垫的理想方案，具备防粘连且可重复使用的特点。
技术规格与应用 / Technical Specifications & Applications
针对 PCB、FPC、软硬结合板及 IC 载板等精密压合需求，我们的高温耐压缓冲垫提供以下专业参数：
| 项目 (Item) | 参数值 (Value) |
| 硬度 (Hardness) | 85 – 90 Shore A |
| 耐温 (Temperature) | 280°C |
| 抗压 (Pressurization) | > 45 Kg/cm² |
| 使用寿命 (Life Times) | 约 600 次 |
| 防黏层 (Surface) | 铁氟龙纳米涂层 (Teflon Nano-coating) |
完善的压合解决方案组合 / Complete Lamination Solution
为了达到最佳的压合效果，建议将此高温耐压缓冲垫搭配立兴的其他内核产品使用：
烧付铁板 (Silicone Iron Pad)：提供结构支撑与均温效果。
FPC 绿色硅胶垫 (FPC Green Cushioning Pad)：强化局部压力补偿。
欲了解更多关于电路板制程的国际标准，请参考 IPC 国际电子电路标准组织 的官方规范。
LIXING High-Temperature Press Cushion Pad: Premium Lamination Solution for PCB & IC Substrates
The High-Temperature Press Cushion Pad is an essential consumable for high-end manufacturing in the modern electronics industry. Developed by Lixing Composite Material, this High-Temperature Press Cushion Pad utilizes advanced Teflon (PTFE) nano-coating technology as an anti-stick layer, ensuring stable performance under extreme processing conditions. It is the ideal long-term solution to replace traditional kraft paper and silicone pads in precision lamination.
Why Choose the LIXING High-Temperature Press Cushion Pad?
The internal structure of this High-Temperature Press Cushion Pad is engineered with multiple layers, including high-elastic PTFE fiber fabric, high-temperature heat-conductive fluororesin, and fluororesin high-tensile fiber fabric. By integrating a nano-release coating, it effectively addresses common pain points in the lamination process:
Extreme Temperature Resistance: This High-Temperature Press Cushion Pad operates stably in environments up to 280°C.
Superior Pressure Durability: With a pressurization capacity exceeding 45 Kg/cm², it ensures uniform pressure distribution during lamination.
Sustainable Efficiency: Designed as a reusable alternative to kraft paper, it offers non-stick properties and a significantly longer service life, reaching approximately 600 cycles.
Technical Specifications & Applications
Our High-Temperature Press Cushion Pad is specifically designed for the lamination of PCBs, FPCBs, Rigid-Flex boards, IC substrates, HDI, and high-frequency/high-speed boards.
| Item | Specification Value |
| Hardness | 85 – 90 Shore A |
| Working Temperature | 280°C |
| Pressurization | > 45 Kg/cm² |
| Service Life | Approx. 600 cycles (Depending on process) |
| Surface Coating | Teflon Nano-coating |
Integrated Lamination Solutions
To achieve the highest production yields, we recommend using the High-Temperature Press Cushion Pad in combination with Lixing’s core product suite:
Silicone Iron Pads (Lamination Steel Pads): For structural support and even heat distribution.
FPC Green Cushioning Pads: For enhanced local pressure compensation.
PTFE (Teflon) Film Tapes & Polyimide Tapes: For edge protection and high-temp insulation.
For further technical standards regarding circuit board manufacturing, please refer to the IPC (Association Connecting Electronics Industries) official guidelines.
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