导热垫片：高效间隙填充与极致缓冲的热管理解决方案
在高性能计算与功率电子设备的热管理设计中，导热垫片是消除热阻、提升热交换效率的关键接口材料。立兴复合材料提供的导热垫片系列，具备优异的柔软性、弹性与高度压缩性，能有效填补发热组件与散热模块间的微小空气间隙，确保电子产品在高负载环境下的稳定性与安全性。
【为什么选择立兴导热垫片？】
极致柔软与高压缩性：硬度范围仅为 5 至 40 Shore B，能在极低压力下达成高度压缩，并与不平整表面紧密贴合，极大化接触面积。
宽广的导热性能选择：提供从 1.0 W/m·K 到 10.0 W/m·K 的多种等级，精准对应从消费电子到高功率工业设备的散热需求。
卓越的绝缘与防火性：符合 UL 94 V-0 / V-1 耐燃等级，并具备可靠的电气绝缘防护，确保精密电路运作安全无虞。
抗震与保护功能：材质兼具良好的缓冲效果，能吸收机械震动并保护脆弱的电子零件不受压力损伤。
全方位的客制化服务：厚度支持 0.25mm 至 1.3mm，并可依照客户图面需求进行精密模切 (Die-cut) 或提供便捷的卷料供应。
【技术参数表】
| 项目 (Item) | 详细参数指针 (Parameter) |
| 产品名称 | 导热垫片 (Thermal Pad) |
| 导热系数 | 1.0 ~ 10.0 W/m·K (依等级选用) |
| 产品硬度 | 5 Shore B ~ 40 Shore B (极致软质) |
| 厚度范围 | 0.25mm ~ 1.3mm |
| 耐温范围 | -40°C 至 200°C |
| 耐燃等级 | UL 94 V-0 / V-1 |
| 耐电压 | < 4kV |
| 比重 / 密度 | 1.5 ~ 2.0 g/cm³ |
| 客制化内容 | 颜色、尺寸、形状及黏性需求调整 |
【产品应用场景】
内核操作数件：广泛应用于 CPU、GPU 散热，有效降低芯片运作热阻。
散热模块：作为散热模块与金属底盘、外壳间的高效热传导接口。
电源与能源系统：适用于电源供应器及高功率 LED 照明应用的热能管理。
通信与车用电子：针对 5G 通信设备与车用功率组件提供稳定的导热与缓冲保护。
Thermal Pad / Silicone Gap Pad: Premium Solution for GAP Filling
In the thermal management design of high-performance computing and power electronic equipment, the Thermal Pad is a critical interface material for eliminating thermal resistance and enhancing heat exchange efficiency. The thermal pad series provided by Lixing Compound Material features exceptional softness, elasticity, and high compressibility, effectively filling micro air gaps between heat-generating components and cooling modules to ensure the stability and safety of electronic products in high-load environments.
[Why Choose Our Thermal Pad?]
Extreme Softness & High Compressibility: Hardness ranges from only 5 to 40 Shore B, allowing for high compression under very low pressure to conform perfectly to uneven surfaces and maximize contact area.
Wide Range of Thermal Performance: Available in multiple grades from 1.0 W/m·K to 10.0 W/m·K, accurately meeting the heat dissipation requirements of various electronic devices.
Superior Insulation & Fire Resistance: Complies with the UL 94 V-0 / V-1 highest flame-retardant rating and provides reliable electrical insulation to ensure the safety of precision circuits.
Vibration Damping & Protection: The material provides an excellent cushioning effect, absorbing mechanical vibrations and protecting fragile electronic components from pressure damage.
Comprehensive Customization: Supports thicknesses from 0.25mm to 1.3mm, with options for precision die-cutting based on customer drawings or convenient roll supply.
[Technical Specifications]
| Item | Parameter |
| Product Name | Thermal Pad / Silicone Gap Pad |
| Thermal Conductivity | 1.0 ~ 10.0 W/m·K (Grade dependent) |
| Hardness | 5 Shore B ~ 40 Shore B (Ultra-soft) |
| Thickness Range | 0.25mm ~ 1.3mm |
| Temp. Resistance | -40°C to 200°C |
| Flame Resistance Rating | UL 94 V-0 / V-1 |
| Withstand Voltage | < 4kV |
| Proportion (Density) | 1.5 ~ 2.0 g/cm³ |
| Customization | Color, Size, Shape, and Adhesive requirements |
[Applications]
Core Computing: Widely used for CPU and GPU cooling to effectively reduce chip thermal resistance.
Thermal Modules: Acts as a high-efficiency thermal interface between cooling modules and metal chassis or casings.
Power & Energy Systems: Suitable for thermal management in power supplies and high-power LED lighting applications.
Telecommunications & Automotive: Provides stable thermal conduction and cushioning protection for 5G equipment and automotive power components.
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FPC 压合材料
导热硅胶材料
