绿色硅胶垫：热压制程均温与高精密缓冲的卓越方案
在电子制造与 FPC 软性电路板压合制程中，绿色硅胶垫是达成均匀传热与压力释放的关键媒介。立兴复合材料提供的绿色硅胶垫，结合高品质硅胶与玻璃纤维结构，具备优异的耐高温、耐高压与绝缘性能，能有效提升产品良率并延长生产设备的使用寿命。
【为什么选择立兴绿色硅胶垫？】
优异的导热与均温性：硅胶层能使热度均匀分布于表面，避免局部过热或烫伤发生，确保压合品质稳定。
卓越的缓冲与耐压：具备强大的弹性与缓冲性能，能有效分散热压机压力，防止操作材料受损。
高重复使用与长寿命：正常操作条件下使用寿命可达 2,000 至 3,000 次，降低耗材汰换频率，节省生产成本。
抗静电与绝缘防护：具备优良的耐电压特性与抗静电性能，适用于各类敏感电子零件固定与屏蔽。
全方位的客制化服务：长度、宽度、厚度与硬度皆可依制程需求调整，并支持贴背胶加工、卷材或精密冲型出货。
【技术参数表】
| 项目 (Item) | 规格参数 (Specification) | 备注 (Note) |
| 产品名称 | 绿色硅胶垫 (Green Silicone Pad) | — |
| 材质组成 | 硅胶 + 玻璃纤维 (Silicone + Glass Fiber) | — |
| 比重 (密度) | 1.3 ± 0.2 g/cm³ | — |
| 撕裂强度 | > 70 kgf/cm² | — |
| 延伸率 | 380% ± 10% | — |
| 硬度 | 50 HA ± 5 HA | — |
| 玻纤厚度 | 0.2 ± 0.02 mm | — |
| 耐温性能 | 200°C | — |
| 建议温度 | 175°C ～ 195°C | — |
| 使用寿命 | 约 2,000 ～ 3,000 次 | 视操作条件而异 |
Green Silicone Pad: Premium Solution for Thermal Conductivity & Buffering
In the electronic manufacturing and FPC (Flexible Printed Circuit) lamination processes, the Green Silicone Pad is a critical medium for achieving uniform heat transfer and pressure release. The Green Silicone Pad provided by Lixing Compound Material combines high-quality silicone with a glass fiber structure, offering excellent high-temperature resistance, high-pressure endurance, and superior insulation properties, effectively improving product yield and extending the lifespan of production equipment.
[Why Choose Our Green Silicone Pad?]
Optimized Heat Transfer: The silicone layer ensures heat is distributed evenly across the surface, preventing localized overheating or burns and ensuring consistent lamination quality.
Superior Elasticity & Buffering: Features strong elastic and cushioning properties that effectively distribute hot press pressure, protecting operational materials from damage.
High Reusability & Durability: Under normal operating conditions, the service life can reach 2,000 to 3,000 cycles, reducing the frequency of consumable replacement and lowering costs.
Anti-static & Insulation Protection: Equipped with excellent voltage resistance and anti-static performance, suitable for securing and shielding sensitive electronic components.
Comprehensive Customization: Length, width, thickness, and hardness can all be adjusted to meet specific process requirements. Supports adhesive backing, roll form, or precision die-cut shipping.
[Technical Specifications]
| Item | Specification | Note |
| Name | Green Silicone Pad | — |
| Composition | Silicone + Glass Fiber | — |
| Density | 1.3 ± 0.2 g/cm³ | — |
| Peel Strength | > 70 kgf/cm² | — |
| Elongation | 380% ± 10% | — |
| Hardness | 50 HA ± 5 HA | — |
| GF Thickness | 0.2 ± 0.02 mm | — |
| Temp Resistance | 200°C | — |
| Operating Temp | 175°C – 195°C | — |
| Service Life | Approx. 2,000 – 3,000 times | Depending on conditions |
[Notice & Maintenance]
Installation: Ensure the hot plate surface is flat and free of scratches before installation. Install the pad as flatly as possible to the heating surface for optimal adhesion.
Handling: Avoid sharp bending to prevent material deformation or structural damage to the internal fiberglass.
Temperature Optimization: Recommended operating temperature is 175–195°C. Using lower temperatures within this range can significantly extend the product’s service life.
导电硅胶材料
FPC 压合材料
导热硅胶材料
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