FPC Process and Lamination Products

FPC Manufacturing Process Overview

1. Substrate Preparation
   Polyimide (PI) or PET films are selected as the base material. They are cleaned and dried to ensure a dust-free and oil-free surface.

2. Circuit Patterning
   Copper is patterned onto the substrate through etching or plating, forming the required conductive traces.

3. Drilling & Plating
   Holes are drilled where interconnections are needed, followed by copper plating to establish reliable vias between layers.

4. Lamination
   This is a critical step in the FPC process, where multiple layers of PI films, adhesive, and copper foil are stacked and bonded under heat and pressure.

   • During this stage, lamination carriers are required, and the Silicone Iron Pad (also known as Silicone Steel Plate) is widely applied.

   • Functions of the Silicone Iron Pad:

     • Provides uniform pressure and thermal conduction;

     • Features a high-temperature resistant silicone surface that protects materials from scratches or dents caused by direct contact with metal press plates;

     • Enhances process stability, ensuring better dimensional accuracy and minimizing warpage after lamination.

   • For FPC manufacturers, it is an essential auxiliary material that directly affects yield and product quality.

5. Surface Finishing
   Depending on application requirements, surface finishes such as ENIG, OSP, or tin plating are applied to improve solderability and oxidation resistance.

6. Testing & Cutting
   Electrical testing and visual inspection are performed, followed by precision cutting into individual circuits before final shipment.

👉 Conclusion: Every stage in FPC production is crucial, but the lamination step with Silicone Iron Pad ensures stable bonding of multilayer structures and plays a key role in improving yield and product reliability.