Tag Archives: Release Fabric

Zero-Stick Lamination: PTFE Release Technology

ptfe-tape-release-mechanism-lamination

In the high-pressure lamination process of multilayer PCBs and FPCs, resin bleed is an inevitable byproduct. If not controlled, this resin can adhere to press plates and molds, causing downtime and increasing rework costs. PTFE Coated Fiberglass Tapes and Release Fabrics are indispensable consumables that ensure a smooth “Zero-Stick” separation. Physical & Thermodynamic Principles: Low […]

Zero-Stick Lamination: PTFE Release Fabric

ptfe-fiberglass-fabric-release-mechanism-lamination

During the high-temperature, high-pressure lamination process of multilayer PCBs and FPCs, melted resin bleed is inevitable. However, if this semi-liquid resin adheres to the steel press plates, it causes severe equipment damage and production downtime. PTFE Coated Fiberglass Fabric (Teflon Tape) acts as a pure release and isolation consumable. Leveraging its ultra-low surface energy and […]