In modern electronic designs striving for higher power density, the Contact Thermal Resistance between heat-generating components (like MOSFETs and IGBT modules) and heatsinks remains a critical bottleneck. While standard Thermal Pads effectively fill micro-gaps, specific applications—such as high-power supply assembly or FPC multi-layer lamination—subject the pad to extreme mechanical stress and high-voltage insulation challenges. Here, […]
Tag Archives: Lamination Process
02
Apr
Apr
In the high-pressure lamination process of multilayer PCBs and FPCs, resin bleed is an inevitable byproduct. If not controlled, this resin can adhere to press plates and molds, causing downtime and increasing rework costs. PTFE Coated Fiberglass Tapes and Release Fabrics are indispensable consumables that ensure a smooth “Zero-Stick” separation. Physical & Thermodynamic Principles: Low […]
29
Mar
Mar
During the high-temperature, high-pressure lamination process of multilayer PCBs and FPCs, melted resin bleed is inevitable. However, if this semi-liquid resin adheres to the steel press plates, it causes severe equipment damage and production downtime. PTFE Coated Fiberglass Fabric (Teflon Tape) acts as a pure release and isolation consumable. Leveraging its ultra-low surface energy and […]