Conductive foam fits seams with a gap that need grounding and cushioning. Use the product page’s shielding band, two-direction surface resistance and adhesive retention to decide where it belongs in phones, laptops and communication equipment.
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The silicone layer of an aluminum foil silicone sheet wraps trace steps during FPC hot pressing so recesses still get pressure for filling, while the foil keeps the plane flat. Four benefits, a stress model and three specs to check.
A thermal gap pad can carry heat and cushioning duty: 0.25–1.3 mm, 5–40 Shore B and 1.0–10.0 W/m·K grades, with a transmissibility model showing when cushioning helps.
Copper Foil Self-Adhesive Single-Sided Tape uses a copper substrate with listed dimensional stability in die-cutting and lamination. Hooke’s law shows how 0.009 to 0.07 mm substrate thickness affects stretch, plus what to send with a sample request.
Platinum cured transparent silicone tubing forms no peroxide by-products, contains no plasticizers and resists bloom. Includes a bore-size contact-area check and an RFQ list.
The H-GF-GY two-component thermal silicone encapsulant lists UL 94 V-0 and 1.0 to 3.0 W/m·K. Learn how V-0 is judged, how thermal inertia affects ignition delay, and what to check before requesting samples.
A co-extruded nickel-graphite conductive silicone gasket can be made in a custom profile for an existing groove. Size it with compression ratio and gland fill, then request samples.
YD-08-YL polyimide gold finger tape is rated ≥ 8 kV withstand voltage and ≥ 10^13 Ω surface resistivity at 0.065 mm total thickness. Learn how those figures were measured and how to judge insulation margin for PCB plating masking and component fixing.
Lixing’s Heat Conductive Silicone Cap is rated -40 to +180°C with Shore A 70±5 hardness. Estimate expansion mismatch with the linear thermal expansion equation and see what to check before requesting samples.
Dry metal joints touch only at asperities. LXPCM phase change thermal pads place as solid pads, then soften at 45 to 55°C to wet the interface and expel air, with 0.08 °C·in²/W impedance.






