A practical view of interface conformity, pressure buffering, and steady conduction for PCB, FPC, and IC-substrate lamination.
Author Archives: lixingdotcom
Heat conductive materials, latest news
Thermal Gap Pad Selection: Balancing Hardness, Compression, and Interface Load
16
Sep
Sep
A practical look at how hardness and compression interact with assembly tolerance, surface contact, and component load in power-module thermal interfaces.
Heat conductive materials, latest news
Automated Dispensing of 4W Thermal Gel: Why Nozzle Radius Matters
14
Sep
Sep
A source-grounded engineering view of nozzle geometry, pressure, flow path, and interface control when dispensing blue one-component thermal gel.
14
Sep
Sep
Use a validated thermal-interface view for 4W Thermal Gel, linking gap filling with process control and formula-based estimation.
Heat conductive materials, latest news
Designing Potting Interfaces with Contact Thermal Resistance in Mind
12
Sep
Sep
A practical look at how wetting, voids, and effective contact area shape the interface performance of a two-component thermally conductive silicone encapsulant.
12
Sep
Sep
A practical framework for reviewing chemical compatibility, diffusion, sealing interfaces, and operating conditions when specifying an FFKM O-ring.
Heat conductive materials, latest news
How Phase Change Thermal Pads Lower Interface Thermal Resistance: A Contact-Resistance View of Gap Filling
11
Sep
Sep
Starting from microscopic gaps between a heat source and heat sink, this article explains the material mechanism of phase change thermal pads, the thermal-interface-resistance model, and key selection considerations.
Heat conductive materials, latest news
How Aluminum Foil Thermal Tape Bridges a Thermal-Interface Path: Thickness vs. Conductivity
11
Sep
Sep
Starting from microscopic gaps at an assembly interface, this article explains the material mechanism of aluminum foil thermal tape, the Fourier one-dimensional conduction model, and key selection considerations.
Conductive materials, latest news
How Conductive Cloth Tape Supports an EMI Shielding Path: Absorption Loss and Grounding Design
10
Sep
Sep
Starting from grounding continuity at enclosure seams, this article explains the material mechanism of conductive cloth tape, the Schelkunoff absorption-loss formula, and key selection considerations.
Conductive materials, latest news
How Should an EMI Shielding Gap Be Controlled? Conductive Foam Contact Design
09
Sep
Sep
A practical engineering view of how conductive foam uses compressible conformity and distributed contact to support EMI grounding at enclosure boundaries.