YD-08-YL polyimide gold finger tape is rated ≥ 8 kV withstand voltage and ≥ 10^13 Ω surface resistivity at 0.065 mm total thickness. Learn how those figures were measured and how to judge insulation margin for PCB plating masking and component fixing.
Category Archives: FPC Lamination Materials
The PTFE film face resists strong acids, alkalis and chemical solvents, with 0.15 mm total thickness and a 260°C maximum temperature. Learn how chemicals reach equipment through the film and the tape edge, and what to send with a sample request.
Lixing masking tape lists tensile strength above 75 N/25mm. This article reads it alongside peel strength and thickness to explain long pulls, one-piece removal and what to prepare for selection.
Use loaded area, temperature rating, hardness and release surface to assess a gold silicone buffer pad for PCB and FPC lamination.
Select an FPC red silicone pad by checking the 160–250°C recommended operating range, 50 HA ±5 hardness, flat contact and the actual pressure-time recipe.
An aluminum foil silicone sheet typically lasts 6,000 to 8,000 cycles on an FPC quick press. Hold pressure, temperature and hot plate flatness to stay in the upper range.
YD-08-YL polyimide gold finger tape is rated 260°C for 30 minutes without deforming and peels off without residue, suiting PCB plating, painting and baked-finish masking. This article covers its high-temperature benefits and the temperature and time conditions to compare before selecting it.
See how 180°C heat resistance, a 50 ± 2 μm profile and transparent PET backing support lamination protection and precision positioning.
See how crepe-paper conformability, holding power, and controlled peel conditions support stable industrial masking and cleaner removal.
Assess quick-press compatibility through machine fit, platen contact, and heat-flow conditions using verified silicone steel pad data.






