Category Archives: Lamination

Managing In-Plane Temperature Variation in FPC Lamination with a Green Silicone Pad

FPC綠色矽膠墊平整貼合於熱壓界面的工業微距示意,聚焦均勻傳熱與矽膠玻纖結構

An engineering view of heat diffusion, interface conformity, and pressure buffering when applying an FPC Green Cushing Pad in hot-press lamination.

Preventing Flow Drift in Semiconductor CMP Slurry Delivery: Shear Strain Fatigue and Anti-Buckling Mechanics of Silicone Tubing

silicone-tubing-shear-fatigue-anti-buckling

In semiconductor fab CMP (Chemical Mechanical Planarization) slurry transfer and precision dispensing systems, fluidic tubing encounters severe high-frequency cyclic squeezing and negative pressure pulses. Under continuous dynamic shear and tight bend installations: Conventional Tubing: Suffers from shear strain fatigue, leading to lumen Buckling Failure (flattening). Volumetric Decay: Causes severe volumetric flow rate drift, degrading CMP […]