Tag Archives: Thermal Interface Material

Can You Compare D5470 Values for Phase Change Thermal Pads? Check Interface Filling and Four Test Conditions

粉紅色相變導熱墊片貼合功率模組與散熱器界面的工業微距示意

Before comparing phase change thermal pad data, align pressure, thickness, reported property, and contact-surface conditions, then evaluate interface filling in the total resistance path.

Thermal Gel Electrical Insulation: Reading Volume Resistivity (≥ 9.0 × 10¹² Ω·cm) and Test Conditions

4W 藍色導熱凝膠由點膠針筒點在鋁散熱器熱源面上,背景為電路板與萬用電錶(立興官網產品圖)

How to convert thermal gel volume resistivity into bondline resistance with R_v = ρ_v × t / A, and which test conditions and withstand data to check before comparing datasheets.

Thermal Grease for Wide Temperature Ranges: Interface Expansion and Thermal Impedance from -40°C to 250°C

灰色導熱硅酯(導熱膏)覆蓋在處理器金屬頂蓋上的導熱界面,對應寬溫冷熱循環應用

Using the linear thermal expansion equation and the ASTM D5470 thermal impedance concept, this article explains how hot-cold cycling affects a thermal grease interface and what to check when selecting Lixing Thermal Grease.

Fiberglass Thermal Conductive Tape Interface Contact: How a 0.095 mm Bond Line Shapes Thermal Impedance

立興玻纖導熱膠帶官方產品圖:白色玻纖導熱膠帶捲材與裁切片,用於電子元件與散熱器之間的界面貼合

When LED modules and power conversion units run hotter than simulated, the interface is often the cause rather than the heat sink. This article uses published specifications and ASTM D5470-17 to explain the role of a 0.095 mm tape in the heat path.

Low-Thermal-Resistance Design with Thermal Grease: From Interface Voids to Bond-Line Thickness

灰色導熱膏在功率電子元件與散熱器之間填補微觀間隙的低熱阻應用示意

A practical look at how thermal grease fills microscopic interface gaps and how the NIST steady-state resistance model connects thickness, heat flux, and temperature difference.

Automated Dispensing of 4W Thermal Gel: Why Nozzle Radius Matters

自動點膠針嘴將藍色 4W 導熱凝膠均勻施作於民用電子散熱組件

A source-grounded engineering view of nozzle geometry, pressure, flow path, and interface control when dispensing blue one-component thermal gel.

How Phase Change Thermal Pads Lower Interface Thermal Resistance: A Contact-Resistance View of Gap Filling

立興複合材料相變導熱墊片(LXPCM)產品特寫:粉色墊片中央呈現紫色相變軟化區域,於模糊工業實驗室背景前

Starting from microscopic gaps between a heat source and heat sink, this article explains the material mechanism of phase change thermal pads, the thermal-interface-resistance model, and key selection considerations.

How Aluminum Foil Thermal Tape Bridges a Thermal-Interface Path: Thickness vs. Conductivity

立興複合材料鋁箔導熱膠帶(H-TT-AL)產品特寫:銀色鋁箔捲裝膠帶於電路板散熱應用情境前

Starting from microscopic gaps at an assembly interface, this article explains the material mechanism of aluminum foil thermal tape, the Fourier one-dimensional conduction model, and key selection considerations.