Use loaded area, temperature rating, hardness and release surface to assess a gold silicone buffer pad for PCB and FPC lamination.
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FPC Lamination Materials, Latest News
FPC Lamination Pad Pressure Resistance: Loaded Area, Compressive Stress and Pad Selection
24
Sep
Sep
Using the compressive stress model σ = F⊥ / A, this article explains how loaded area, stack height differences and repeated hot pressing affect FPC lamination, and summarizes the official pressure, hardness and temperature data of the Lixing FPC Lamination Silicone Buffer Pad.
