In advanced automotive LiDAR systems, high-resolution camera modules, AI co-packaged optics (CPO), and sealed electronic control units (ECUs), thermal interface material (TIM) stability under thermodynamic stress is critical. TIMs must achieve low thermal impedance at minimal mounting forces while suppressing volatile organic outgassing and interfacial pump-out degradation. Standard thermal pads exposed to continuous high temperatures […]
Tag Archives: Pump-out Effect
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Thermal Interface Technology: Physical Properties and Applications of Thermal Gel in Micro-gap Filling
04
Mar
Mar
In high-power density electronic assemblies, the thermal resistance between the heat source and the heatsink is a critical factor for system reliability. Thermal gel, acting as an interface material with both fluid-like wetting and solid-like stability, effectively addresses the issues of dry-out in traditional greases and the thickness limitations of thermal pads. Technical Principle: Thixotropy […]