Tag Archives: Char Layer

The Final Line of Defense: Analyzing Flame Retardancy and UL 94 V-0 Standards in Thermal Gap Pads

lixing-94V0

In high-power density PCB designs, thermal interface materials are responsible not just for heat dissipation, but for the critical task of suppressing fire propagation. The ultimate safety of an electronic device often hinges on the “Self-Extinguishing” properties of its materials under extreme conditions. Chemical Principle: Synergistic Flame Retardancy and Char Formation While silicone inherently possesses […]