In Flexible Printed Circuit (FPC) multi-layer lamination and Coverlay bonding, ensuring uniform temperature and pressure is the ultimate challenge. The Silicone iron pad serves as the vital thermal interface, directly influencing resin flow control and final product flatness. Material Science: Thermal Gradients and Stress Distribution Models Steady-state Conduction & Fourier’s Law: The pad must transfer […]
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The Foundation of Precision Lamination: Thermodynamic Analysis of Silicone Iron Pads in FPC Processes
29
Apr
Apr
In Flexible Printed Circuit (FPC) multi-layer lamination and Coverlay bonding, ensuring uniform temperature and pressure is the ultimate challenge. The Silicone iron pad serves as the vital thermal interface, directly influencing resin flow control and final product flatness. Material Science: Thermal Gradients and Stress Distribution Models Steady-state Conduction & Fourier’s Law: The pad must transfer […]
22
Aug
Aug
FPC Manufacturing Process Overview Substrate PreparationPolyimide (PI) or PET films are selected as the base material. They are cleaned and dried to ensure a dust-free and oil-free surface. Circuit PatterningCopper is patterned onto the substrate through etching or plating, forming the required conductive traces. Drilling & PlatingHoles are drilled where interconnections are needed, followed by […]