Tag Archives: Dielectric Breakdown Voltage

In modern electronic designs striving for higher power density, the Contact Thermal Resistance between heat-generating components (like MOSFETs and IGBT modules) and heatsinks remains a critical bottleneck. While standard Thermal Pads effectively fill micro-gaps, specific applications—such as high-power supply assembly or FPC multi-layer lamination—subject the pad to extreme mechanical stress and high-voltage insulation challenges. Here, […]