In the high-pressure lamination process of multilayer PCBs and FPCs, resin bleed is an inevitable byproduct. If not controlled, this resin can adhere to press plates and molds, causing downtime and increasing rework costs. PTFE Coated Fiberglass Tapes and Release Fabrics are indispensable consumables that ensure a smooth “Zero-Stick” separation. Physical & Thermodynamic Principles: Low […]
Category Archives: Lamination
29
Mar
Mar
During the high-temperature, high-pressure lamination process of multilayer PCBs and FPCs, melted resin bleed is inevitable. However, if this semi-liquid resin adheres to the steel press plates, it causes severe equipment damage and production downtime. PTFE Coated Fiberglass Fabric (Teflon Tape) acts as a pure release and isolation consumable. Leveraging its ultra-low surface energy and […]
26
Mar
Mar
In the precision Lamination and ACF (Anisotropic Conductive Film) bonding process of Flexible Printed Circuits (FPC), protecting fragile microcircuits and ensuring absolute pressure uniformity under extreme heat and force is crucial for production yield. The High Tear Strength Silicone Pad frequently used by engineers is not a thermal consumable in this process; instead, it serves […]
23
Mar
Mar
In high-density electronic packaging, localized heat (Hot Spots) from a single component is a leading cause of system failure. Many engineers mistakenly believe thermal pads just need to be “placed” on the surface. In actual thermal module assembly, Thermal Silicone Aluminum Foil requires a precise “pressing” (lamination) process to activate its dual mechanisms of horizontal […]
Lamination, latest news
The Ultimate Non-Stick Interface: Analyzing High-Temperature Stability and Low Friction in PTFE Tapes
18
Mar
Mar
In automated heat sealing, plastic extrusion, and PCB soldering, machinery must frequently contact molten materials under intense heat. Without surface protection, adhesion and carbon buildup become inevitable, leading to downtime. PTFE (Teflon) Tape provides the lowest surface energy in the industry along with exceptional thermal stability, serving as the “smooth interface” that keeps machines running […]
Lamination, latest news
The Core of Precision Fixing: Analyzing Hole Design and Hermetic Stability in PCB Vacuum Table Silicone Mats
15
Mar
Mar
In PCB drilling, AOI inspection, and precision bonding equipment, the quality of vacuum table suction dictates machining accuracy. As the critical interface between the machine stage and the circuit board, Vacuum Silicone Mats must not only possess excellent abrasion resistance but also facilitate perfect pressure conduction and uniform distribution through precisely engineered “ventilation holes.” Mechanical […]
22
Aug
Aug
FPC Manufacturing Process Overview Substrate PreparationPolyimide (PI) or PET films are selected as the base material. They are cleaned and dried to ensure a dust-free and oil-free surface. Circuit PatterningCopper is patterned onto the substrate through etching or plating, forming the required conductive traces. Drilling & PlatingHoles are drilled where interconnections are needed, followed by […]