In PCB drilling, AOI inspection, and precision bonding equipment, the quality of vacuum table suction dictates machining accuracy. As the critical interface between the machine stage and the circuit board, Vacuum Silicone Mats must not only possess excellent abrasion resistance but also facilitate perfect pressure conduction and uniform distribution through precisely engineered “ventilation holes.”
Mechanical and Fluid Principle: Pore Effect and Interfacial Sealing
The performance of a Silicone mat during the vacuum process is governed by its micro-scale physical properties:
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Pore Arrays and Vacuum Pathways: The hole diameter and pitch must be meticulously calculated. Oversized holes can cause localized dimples in thin boards (like FPCs), while undersized holes restrict the evacuation rate. Lixing’s micro-drilling technology ensures vacuum suction spreads uniformly across the PCB in mere fractions of a second ($\Delta t < 0.5\text{s}$).
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High Compression Recovery and Sealing: Under vacuum, the mat is compressed by atmospheric pressure. The high elasticity of the Silicone forms a perfect microscopic dynamic seal around each hole, preventing leakage and maintaining stable negative pressure even on slightly uneven PCB surfaces.
Industrial Application: High-Speed Drilling, AOI Inspection, and Automated Loading Stages
For the rigorous demands of precision machinery, Lixing Composite Material delivers high-reliability solutions:
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Minimizing Indentation: For components sensitive to surface pressure, we provide ultra-soft yet high-toughness mats that leave no permanent marks on the PCB surface even under high suction forces.
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Chemical Resistance and Longevity: In environments exposed to fluxes and solvents, Lixing materials offer superior chemical stability, ensuring that holes remain unblocked and maintain their shape over prolonged high-temperature cycles.
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