In Flexible Printed Circuit (FPC) multi-layer lamination and Coverlay bonding, ensuring uniform temperature and pressure is the ultimate challenge. The Silicone iron pad serves as the vital thermal interface, directly influencing resin flow control and final product flatness.
Material Science: Thermal Gradients and Stress Distribution Models
Steady-state Conduction & Fourier’s Law: The pad must transfer thermal energy from the heating plate to the FPC stack without bias. This is governed by Fourier’s Law: q = k * (dT / dx) (Pure text: q = k * (dT / dx), where q is heat flux, k is thermal conductivity, and dT/dx is the temperature gradient)
Stress Uniformity via Precision Flatness: Any deviation in flatness leads to pressure P variance: P = F / A (Pure text: P = F / A) Lixing pads achieve geometric tolerances within 0.01mm, ensuring uniform resin flow across the entire panel.
Interfacial Chemistry & Anti-stick Properties: Our composite coating provides a low-surface-energy interface, allowing for seamless release after cooling and reducing maintenance cycles.
Industrial Applications
FPC Multi-layer Lamination: Precision thermal and pressure interface.
Coverlay Bonding: Precise resin flow control for pad cleanliness.
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