In 5G telecom equipment and high-performance computing (HPC) AI servers, Thermal Pads are not just thermal bridges—they are vital shields for component reliability. Lixing’s Low Bleed-out Thermal Pad Series provides the ultimate balance between high conductivity and long-term durability.
Material Science: Conductive Fillers and Long-Chain Cross-linking
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Thermal Path and Percolation Theory: High-density Alumina or Boron Nitride particles form continuous thermal networks inside the pad. The conductivity k follows this model: k = (Q * L) / (A * dT) (Pure text: k = (Q * L) / (A * dT), where Q is heat flow, L is thickness, A is area, and dT is temperature gradient)
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Low Bleed-out and Molecular Binding: Conventional silicone pads often release low-molecular-weight oils, contaminating sensitive optics. Lixing uses long-chain siloxane cross-linking to tighten the polymer matrix, locking fillers in place. Total Mass Loss (TML) is kept below 0.1%, ensuring equipment cleanliness.
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Interfacial Wetting and Thermal Resistance: The softness (Shore 00) allows the pad to “wet” the surface, eliminating air gaps and reducing contact resistance (Rc). The total resistance is: R_total = (L / k) + Rc (Pure text: R_total = (L / k) + Rc, where L is thickness, k is conductivity, and Rc is contact resistance)
Industrial Applications
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5G Remote Radio Units (RRU): Provides stable heat dissipation and electrical isolation under vibration.
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Optical Sensor Modules: Prevents siloxane deposition on lenses due to ultra-low outgassing.
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