During Flexible Printed Circuit (FPC) multi-layer lamination and Coverlay encapsulation, adhesive matrices transfer into low-viscosity fluids under process temperatures (160°C – 200°C). Generating absolute thermal uniformity while providing optimized hydro-damping to secure the resin flow boundary is vital to prevent pad contamination. The Silicone Iron Pad, acting as a rigid-flexible thermal structural medium, governs the […]
- English
- Product
Lixing Compound Material Products
- Latest News
- Material Science
- Contact Us
-
