In modern electronic designs striving for higher power density, the Contact Thermal Resistance between heat-generating components (like MOSFETs and IGBT modules) and heatsinks remains a critical bottleneck. While standard Thermal Pads effectively fill micro-gaps, specific applications—such as high-power supply assembly or FPC multi-layer lamination—subject the pad to extreme mechanical stress and high-voltage insulation challenges. Here, […]
Monthly Archives: April 2026
Latest News, Thermal Conductive Materials
Efficient Thermal Management: Mechanism of Thermal Silicone Pads
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Apr
Apr
In high-density electronics, the interface between components and heatsinks is the primary bottleneck for heat dissipation. Air gaps caused by surface roughness act as insulators. Thermal Silicone Pads bridge these micro-gaps, creating a continuous path for heat flow. Physics: Heat Equation and Stress Compensation One-dimensional Steady-state Heat Conduction: q = k * (T1 – T2) […]
02
Apr
Apr
In the high-pressure lamination process of multilayer PCBs and FPCs, resin bleed is an inevitable byproduct. If not controlled, this resin can adhere to press plates and molds, causing downtime and increasing rework costs. PTFE Coated Fiberglass Tapes and Release Fabrics are indispensable consumables that ensure a smooth “Zero-Stick” separation. Physical & Thermodynamic Principles: Low […]
01
Apr
Apr
As Electric Vehicles (EVs) and Energy Storage Systems (ESS) advance towards higher power densities, Liquid Cooling Systems are the standard for thermal management. Cooling lines must endure constant thermal cycling and resist long-term chemical degradation from coolants. EPDM Rubber Tubing (Ethylene Propylene Diene Monomer), with its uniquely saturated molecular backbone, is the premier consumable for […]
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