In 5G telecom equipment and high-performance computing (HPC) AI servers, Thermal Pads are not just thermal bridges—they are vital shields for component reliability. Lixing’s Low Bleed-out Thermal Pad Series provides the ultimate balance between high conductivity and long-term durability. Material Science: Conductive Fillers and Long-Chain Cross-linking Thermal Path and Percolation Theory: High-density Alumina or Boron […]
Monthly Archives: April 2026
In Flexible Printed Circuit (FPC) multi-layer lamination and Coverlay bonding, ensuring uniform pressure and heat distribution across hundreds of micro-nodes is the key to yield. The Lamination Silicone Steel Pad serves as the central component of the lamination fixture, directly influencing thermal transfer efficiency and the quality of post-process release. Material Science: Thermal Gradients and […]
Electrostatic Discharge (ESD) is a silent killer of yield in semiconductor manufacturing and precision electronics assembly. While standard insulating silicone easily accumulates static charges, Anti-static/Dissipative Silicone Pads incorporate conductive media into their molecular chains to create stable charge dissipation pathways, serving as a critical consumable for ESD Protected Areas (EPA). Material Science Principles: Percolation Theory […]
In modern industrial manufacturing, semiconductor cooling systems, and high-temperature fluid transfer processes, tubing is a critical component determining system stability. Traditional PVC or rubber tubes are prone to plasticizer leaching, cracking, or chemical degradation when exposed to high temperatures (>150°C) or corrosive fluids. Industrial-Grade Platinum-Cured Silicone Tubes are the preferred choice for extreme environments due […]
In modern electronic designs striving for higher power density, the Contact Thermal Resistance between heat-generating components (like MOSFETs and IGBT modules) and heatsinks remains a critical bottleneck. While standard Thermal Pads effectively fill micro-gaps, specific applications—such as high-power supply assembly or FPC multi-layer lamination—subject the pad to extreme mechanical stress and high-voltage insulation challenges. Here, […]
In high-density electronics, the interface between components and heatsinks is the primary bottleneck for heat dissipation. Air gaps caused by surface roughness act as insulators. Thermal Silicone Pads bridge these micro-gaps, creating a continuous path for heat flow. Physics: Heat Equation and Stress Compensation One-dimensional Steady-state Heat Conduction: q = k * (T1 – T2) […]
In high-density electronics, the interface between components and heatsinks is the primary bottleneck for heat dissipation. Air gaps caused by surface roughness act as insulators. Thermal Silicone Pads bridge these micro-gaps, creating a continuous path for heat flow. Physics: Heat Equation and Stress Compensation One-dimensional Steady-state Heat Conduction: q = k * (T1 – T2) […]
In the high-pressure lamination process of multilayer PCBs and FPCs, resin bleed is an inevitable byproduct. If not controlled, this resin can adhere to press plates and molds, causing downtime and increasing rework costs. PTFE Coated Fiberglass Tapes and Release Fabrics are indispensable consumables that ensure a smooth “Zero-Stick” separation. Physical & Thermodynamic Principles: Low […]
As Electric Vehicles (EVs) and Energy Storage Systems (ESS) advance towards higher power densities, Liquid Cooling Systems are the standard for thermal management. Cooling lines must endure constant thermal cycling and resist long-term chemical degradation from coolants. EPDM Rubber Tubing (Ethylene Propylene Diene Monomer), with its uniquely saturated molecular backbone, is the premier consumable for […]
- 1
- 2






