In high-density electronics, the interface between components and heatsinks is the primary bottleneck for heat dissipation. Air gaps caused by surface roughness act as insulators. Thermal Silicone Pads bridge these micro-gaps, creating a continuous path for heat flow.
Physics: Heat Equation and Stress Compensation
One-dimensional Steady-state Heat Conduction: q = k * (T1 – T2) / L (q = heat flux, k = thermal conductivity, T1 – T2 = temp difference, L = thickness) Reducing L through compression is vital for maximizing heat transfer.
Total Thermal Resistance Composition: R_total = R_contact1 + R_bulk + R_contact2 Lixing pads achieve high compressibility under low pressure, minimizing R_contact for superior interface wetting.
Applications: Automotive Electronics & Power Supplies
ECU: High resiliency absorbs vibration and compensates for CTE (Coefficient of Thermal Expansion) mismatches.
Power Supplies: Combines low thermal resistance with high dielectric breakdown voltage (> 10kV/mm).
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