During Flexible Printed Circuit (FPC) multi-layer lamination and Coverlay encapsulation, tooling consumables are exposed to extreme cyclical thermodynamic loading. When vacuum quick presses stamp under severe conditions (200°C, 5 MPa), materials must deliver not only high isotropic pressure equalization to wrap ultra-fine pitch conductors safely, but also exceptional interfacial stability across the heterogeneous steel-to-elastomer boundaries. […]
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