Tag Archives: Viscoelastic Compliance

During the vacuum lamination of high-density Multilayer FPCs and Rigid-Flex PCBs, the step-height thickness drop at the rigid-flex junction represents a major mechanical challenge. Rigid Tooling: Exerts extreme stress concentrations on rigid edges, fracturing tracks or prompting resin overflow. Insufficient Pressure Windows: Leave micro-voids trapped within local geometric recesses, leading to inner-layer delamination during reflow. […]