In high-power-density designs such as AI servers and telecom modules, thermal efficiency depends on the quality of the interface. Thermal Pads are engineered to eliminate micro-air gaps via physical deformation, drastically reducing the total system resistance.
Material Science: Phonon Transport and Interfacial Models
Percolation and Thermal Conductivity: Thermal pads utilize high loadings of ceramic fillers to form continuous conduction networks. Heat transfer in non-metals is governed by phonons (lattice vibrations): k = (Q * L) / (A * dT) (Pure text: k = (Q * L) / (A * dT), where Q is heat flow, L is thickness, A is area, and dT is the temperature gradient)
Total Thermal Resistance Model: The compliance of the pad determines its “wetting” ability. Total resistance (R_total) is expressed as: R_total = (L / k) + Rc (Pure text: R_total = (L / k) + Rc, where Rc is the interfacial contact resistance) Lixing pads achieve high deformation under low pressure, minimizing Rc to optimize system cooling.
Low Bleed-out Chemistry: To prevent contamination in sensitive electronics, Lixing utilizes molecular binding technology to keep Total Mass Loss (TML) below 0.1%.
Industrial Applications
HPC & AI Computing: Providing low-resistance thermal paths for high-TDP chips.
Automotive ECU: Exceptional stability under thermal cycling and mechanical vibration.
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