Tag Archives: ThermalManagement

How to Use Two-Part Thermal Encapsulant: From 1:1 Mixing to Module Potting

雙組份導熱封灌膠混合後灌入電子功率模組並填充元件間隙的應用情境

A practical look at mix ratio, working time, curing conditions, and how a two-part thermal silicone encapsulant fills electronic modules while supporting heat transfer and electrical insulation.

Why CPU/GPU Interfaces Still Overheat: How Thermal Grease Addresses Contact Resistance

導熱膏塗抹並接觸晶片表面,展示散熱介面接觸應用情境,立興複合材料出品

Even a flat-looking chip and heat sink surface leaves microscopic air gaps when pressed together. This article looks at thermal interface contact resistance and how thermal grease can help close that gap based on published technical data, plus selection and application notes.