In high-density AI servers, HPC compute modules, and autonomous driving domain controllers (Direct-to-Chip air/liquid chassis), high-power processors operate continuously at elevated temperatures (100°C–150°C). Standard thermal pads pose critical long-term reliability risks under high operational heat: Siloxane Volatilization: Unreacted cyclic siloxanes (D4–D10) vaporize and redeposit onto adjacent optical camera lenses and high-frequency electrical contacts, forming insulating […]
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