Tag Archives: Lixing Compound Materials

How Phase Change Thermal Pads Lower Interface Thermal Resistance: A Contact-Resistance View of Gap Filling

立興複合材料相變導熱墊片(LXPCM)產品特寫:粉色墊片中央呈現紫色相變軟化區域,於模糊工業實驗室背景前

Starting from microscopic gaps between a heat source and heat sink, this article explains the material mechanism of phase change thermal pads, the thermal-interface-resistance model, and key selection considerations.

How Aluminum Foil Thermal Tape Bridges a Thermal-Interface Path: Thickness vs. Conductivity

立興複合材料鋁箔導熱膠帶(H-TT-AL)產品特寫:銀色鋁箔捲裝膠帶於電路板散熱應用情境前

Starting from microscopic gaps at an assembly interface, this article explains the material mechanism of aluminum foil thermal tape, the Fourier one-dimensional conduction model, and key selection considerations.

How Conductive Cloth Tape Supports an EMI Shielding Path: Absorption Loss and Grounding Design

立興複合材料導電布膠帶系列(LX-DDB)產品特寫:捲裝導電布膠帶呈現平紋導電織物表面與導電膠面,於模糊工業廠房背景前

Starting from grounding continuity at enclosure seams, this article explains the material mechanism of conductive cloth tape, the Schelkunoff absorption-loss formula, and key selection considerations.