In high-power density PCB designs, thermal interface materials are responsible not just for heat dissipation, but for the critical task of suppressing fire propagation. The ultimate safety of an electronic device often hinges on the “Self-Extinguishing” properties of its materials under extreme conditions.
Chemical Principle: Synergistic Flame Retardancy and Char Formation While silicone inherently possesses better heat resistance than organic rubbers, achieving the industry-leading UL 94 V-0 rating requires a precise additive strategy:
Endothermic Decomposition: We incorporate inorganic flame retardants such as Aluminum Trihydrate (ATH). Upon exposure to flame, these fillers undergo dehydration, absorbing significant thermal energy and releasing water vapor to dilute oxygen concentration at the interface.
The Char Barrier: During combustion, silicone molecules interact with retardants to form a dense, silicon-carbon “char layer.” This insulating shield blocks heat from penetrating deeper and prevents molten dripping (No Dripping), stopping secondary ignition.
Industrial Application: Security for Data Centers and Servers For mission-critical hardware such as AI servers and power modules operating 24/7, flame retardancy is a non-negotiable requirement:
UL 94 V-0 Compliance: Lixing’s Thermal Gap Pads are certified under rigorous vertical burn tests, ensuring self-extinguishment within 10 seconds of flame removal.
Low Smoke, Zero Halogen (LSZH): For enclosed applications, our halogen-free technology ensures minimal smoke production and zero corrosive gas emission, protecting delicate electronics from acidic damage.
