In electronics assembly, SMT lines, and semiconductor test benches, tabletop surfaces experience continuous friction from tools, PCB assemblies, and component trays, easily accumulating static charges exceeding thousands of volts. Improper tabletop materials pose severe risks: Insulating Rubber: Retains static charges, triggering violent electrostatic discharge (ESD) upon component placement. Overly Conductive Metal/Sheet: Causes instant electrical short-circuiting […]
Monthly Archives: August 2026
Heat conductive materials, Lamination
Preventing Flow Drift in Semiconductor CMP Slurry Delivery: Shear Strain Fatigue and Anti-Buckling Mechanics of Silicone Tubing
03
Aug
Aug
In semiconductor fab CMP (Chemical Mechanical Planarization) slurry transfer and precision dispensing systems, fluidic tubing encounters severe high-frequency cyclic squeezing and negative pressure pulses. Under continuous dynamic shear and tight bend installations: Conventional Tubing: Suffers from shear strain fatigue, leading to lumen Buckling Failure (flattening). Volumetric Decay: Causes severe volumetric flow rate drift, degrading CMP […]
Heat conductive materials, latest news
Preventing Shear Breakdown in Power Modules: Glass-Mesh Stress Constraint and Electric Field Equalization in Thermal Silicone Fabrics
02
Aug
Aug
In EV inverters, solar converters, and industrial servo drives, TO-220 and TO-247 MOSFET/IGBT modules require simultaneously high thermal dissipation and thousand-volt dielectric isolation. Under high assembly clamping torque (0.8–1.2 N·m): Unreinforced TIMs: Suffer from lateral plastic flow, thinning out or puncturing over metal burrs. Dielectric Drop: Triggers catastrophic high-voltage arcing and electrical short circuits. Lixing […]