Tag Archives: power module cooling

Phase Change Thermal Pad Contact: Solid at Assembly, Wets the Heat Sink Interface at 45 to 55°C

LXPCM 相變導熱墊片:方形片材,室溫為固體,達 45°C~55°C 相變溫度後軟化填補散熱接觸面

Dry metal joints touch only at asperities. LXPCM phase change thermal pads place as solid pads, then soften at 45 to 55°C to wet the interface and expel air, with 0.08 °C·in²/W impedance.

Fiberglass Thermal Tape with 5 kV Withstand Voltage: Thin 0.095 mm Insulation That Still Moves Heat

立興玻纖導熱膠帶 H-GT-WH 白色成卷薄帶,用於電源與 LED 模組的導熱絕緣貼合

H-GT-WH fiberglass thermal conductive tape is 0.095 mm thick in total and lists a 5 kV withstand voltage and 0.35 W/(m·K) thermal conductivity for insulating power and LED modules from their heat sinks.

Can You Compare D5470 Values for Phase Change Thermal Pads? Check Interface Filling and Four Test Conditions

粉紅色相變導熱墊片貼合功率模組與散熱器界面的工業微距示意

Before comparing phase change thermal pad data, align pressure, thickness, reported property, and contact-surface conditions, then evaluate interface filling in the total resistance path.

Fiberglass Thermal Conductive Tape Interface Contact: How a 0.095 mm Bond Line Shapes Thermal Impedance

立興玻纖導熱膠帶官方產品圖:白色玻纖導熱膠帶捲材與裁切片,用於電子元件與散熱器之間的界面貼合

When LED modules and power conversion units run hotter than simulated, the interface is often the cause rather than the heat sink. This article uses published specifications and ASTM D5470-17 to explain the role of a 0.095 mm tape in the heat path.

LINE