Separate the roles of the buffer pad, release material, and carrier or hot-plate interface, then verify temperature-time history, pressure, flatness, gaps, and surface covering before blaming one consumable for every mark or resin-flow defect.
Separate the roles of the buffer pad, release material, and carrier or hot-plate interface, then verify temperature-time history, pressure, flatness, gaps, and surface covering before blaming one consumable for every mark or resin-flow defect.