In high-power-density designs such as AI servers and telecom modules, microscopic air gaps between components and heatsinks severely hinder thermal transport. The primary function of a Thermal Pad is to eliminate these insulating micro-air pockets through controlled compression and interfacial polymer creep, minimizing contact resistance.
Material Science: Phonon Transport and Interfacial Resistance Models
Phonon Conduction & Heat Flux: Heat transfer in non-metals is governed by phonons (lattice vibrations). Lixing builds a dense network of ceramic fillers (Al2O3/BN) within the matrix. The heat flux q follows Fourier’s Law: q = k * (dT / d) (Pure text: q = k * (dT / d), where q is heat flux, k is pad thermal conductivity, and d is the compressed thickness of the pad)
Total Thermal Resistance Model: The total thermal resistance R_total is a combination of bulk resistance and interfacial contact resistance Rc: R_total = (d / k) + Rc (Pure text: R_total = (d / k) + Rc, where d is thickness, k is thermal conductivity, and Rc is contact resistance) Lixing pads achieve high deformation under low pressure (20-40% compression ratio), minimizing Rc while preventing mechanical stress on delicate dies.
Low Bleed-out Chemistry: To prevent silicone oil migration under continuous high-temperature stress, Lixing utilizes advanced molecular binding technology to keep Total Mass Loss (TML) below 0.1%.
【Performance Verification & Application Video】
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