High-temperature sealing cannot be reduced to a material name. This article connects initial squeeze, thermal ageing, media compatibility, and gland design, with the limits of an Arrhenius model.
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FPC Lamination Materials, Latest News
Managing In-Plane Temperature Variation in FPC Lamination with a Green Silicone Pad
27
Aug
Aug
An engineering view of heat diffusion, interface conformity, and pressure buffering when applying an FPC Green Cushing Pad in hot-press lamination.
Latest News, Thermal Conductive Materials
How Thermal Pads Fill Assembly Gaps and Build a Conduction Path
26
Aug
Aug
Height variation and uneven mating surfaces can interrupt the thermal path between a component and its heat sink. This article connects gap filling, conformity, slab thermal resistance, and practical selection.
Latest News, Thermal Conductive Materials
Why Reinforce Thermal Silicone Cloth with Fiberglass? Tensile Strength in Assembly
25
Aug
Aug
An engineering look at tensile stress and fiberglass reinforcement in thermal silicone cloth, with practical considerations for cutting, handling, positioning, heat transfer, and electrical insulation.
Latest News, Thermal Conductive Materials
How to Use Two-Part Thermal Encapsulant: From 1:1 Mixing to Module Potting
24
Aug
Aug
A practical look at mix ratio, working time, curing conditions, and how a two-part thermal silicone encapsulant fills electronic modules while supporting heat transfer and electrical insulation.
Latest News, Thermal Conductive Materials
Why Hot Press Bonding Still Damages Precision Components — and How a Thin Silicone Sheet Helps
23
Aug
Aug
In LCM display bonding and FPC/IC lamination, the buffer material’s thermal, temperature, and release performance directly affects yield. Here’s how a thin silicone sheet handles hot press buffering.
Latest News, Thermal Conductive Materials
Why CPU/GPU Interfaces Still Overheat: How Thermal Grease Addresses Contact Resistance
22
Aug
Aug
Even a flat-looking chip and heat sink surface leaves microscopic air gaps when pressed together. This article looks at thermal interface contact resistance and how thermal grease can help close that gap based on published technical data, plus selection and application notes.
Latest News, Thermal Conductive Materials
How a Heat Conductive Silicone Cap Solves Cooling and Insulation for TO-220 Components
21
Aug
Aug
TO-220 packaged power components need both thermal management and electrical insulation. This article explains how a one-piece heat conductive silicone cap addresses both, and what to check when selecting a size.
Latest News, Thermal Conductive Materials
How a Thermal Pad Solves Poor Interface Contact in Thermal Design
19
Aug
Aug
A bigger heat sink won’t fix high thermal resistance caused by a poor interface. See how a thermal Thermal Pad conforms under low pressure to improve contact between components and heat sinks.
Conductive Materials, Latest News
Conductive Foam for EMI Shielding and Grounding: Combining Contact, Gap Filling, and Recovery
18
Aug
Aug
See how conductive fabric, resilient foam, and conductive adhesive work together to support EMI shielding, grounding, gap filling, and compression recovery.