If you have ever disassembled a high-performance power supply or an automotive control module, you might have noticed a material that is thinner than a typical thermal pad, featuring a subtle mesh texture. That is a “Thermal Conductive Silicone Sheet.” Simply put, it is a composite material created by precision-coating silicone elastomers onto high-strength fiberglass […]
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In the development of contemporary high-power electronic devices, effectively managing heat accumulation on the PCB has become a paramount challenge for R&D engineers. Lixing Composite Material specializes in high-performance Thermal Interface Materials (TIMs) to ensure your electronic systems operate reliably under extreme conditions. Deep Technical Insights: Superior Surface Wetting: Our thermal pads are engineered with […]
1. Physical Definition of Dielectric Constant The Relative Dielectric Constant (εr) is a physical quantity that measures a material’s ability to store electrical energy through polarization. It describes the degree to which a material becomes polarized when placed in an electric field. Mathematical Formula: It is defined as the ratio of the capacitance of a […]
Exhibition Overview Name: Dongguan Taiwan Famous Products Fair (Taiwan Expo) Date: September 11–14, 2025 (4 days) Venue: Guangdong Modern International Exhibition Center (Houjie, Dongguan)
1. Chemical Backbone of Thermal Silicone Thermally conductive silicone is based on polysiloxane (–Si–O–Si–). Each Si atom alternates with O atoms, forming the “Si–O backbone.” The Si atoms are typically bonded to methyl groups (–CH₃) or other functional groups. Basic structure: –Si(CH₃)₂–O–Si(CH₃)₂–O– 2. Bond Angles (Bond Foot) in Si–O–Si In this structure: Si atoms adopt […]
1. Definition of Electronegativity Electronegativity is the ability of an atom to attract shared electrons in a chemical bond. A higher value means the atom is more “greedy” for electrons. The most common scale is the Pauling scale. 2. Periodic Table Trends Electronegativity follows clear trends across the periodic table: Increases from left to right […]
FPC Manufacturing Process Overview Substrate PreparationPolyimide (PI) or PET films are selected as the base material. They are cleaned and dried to ensure a dust-free and oil-free surface. Circuit PatterningCopper is patterned onto the substrate through etching or plating, forming the required conductive traces. Drilling & PlatingHoles are drilled where interconnections are needed, followed by […]






