Category Archives: Heat conductive materials

The Key to Long-term Reliability: Analyzing Viscoelasticity and Compression Set in Thermal Silicone Pads

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In modern electronics, thermal management materials must deliver not only high conductivity but also exceptional mechanical stability. Many thermal failures occur not because of a drop in thermal conductivity, but due to Compression Set under long-term thermal pressure, leading to micro-gaps at the interface. Understanding the viscoelastic nature of Thermal Silicone is vital for ensuring […]

Dual Protection for Heat and Electricity: Analyzing Aluminum Foil Tape in Advanced Cooling and EMI Shielding

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In sophisticated thermal management designs, Aluminum Foil Tape is more than a simple adhesive; it combines the physical conductivity of aluminum with the adhesion of high-performance Pressure Sensitive Adhesives (PSA). For heat spreading in tight spaces or on irregular surfaces, aluminum foil tape provides excellent planar thermal conductivity while serving as a critical barrier for […]

Microscopic bond angles of thermally conductive silicone

Microscopic Chemical Bond Angles of Thermally Conductive Silicone

1. Chemical Backbone of Thermal Silicone Thermally conductive silicone is based on polysiloxane (–Si–O–Si–). Each Si atom alternates with O atoms, forming the “Si–O backbone.” The Si atoms are typically bonded to methyl groups (–CH₃) or other functional groups. Basic structure: –Si(CH₃)₂–O–Si(CH₃)₂–O– 2. Bond Angles (Bond Foot) in Si–O–Si In this structure: Si atoms adopt […]

Electronegativity and Silicone rubber

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1. Definition of Electronegativity Electronegativity is the ability of an atom to attract shared electrons in a chemical bond. A higher value means the atom is more “greedy” for electrons. The most common scale is the Pauling scale. 2. Periodic Table Trends Electronegativity follows clear trends across the periodic table: Increases from left to right […]