In modern electronics, thermal management materials must deliver not only high conductivity but also exceptional mechanical stability. Many thermal failures occur not because of a drop in thermal conductivity, but due to Compression Set under long-term thermal pressure, leading to micro-gaps at the interface. Understanding the viscoelastic nature of Thermal Silicone is vital for ensuring […]
Category Archives: Heat conductive materials
In sophisticated thermal management designs, Aluminum Foil Tape is more than a simple adhesive; it combines the physical conductivity of aluminum with the adhesion of high-performance Pressure Sensitive Adhesives (PSA). For heat spreading in tight spaces or on irregular surfaces, aluminum foil tape provides excellent planar thermal conductivity while serving as a critical barrier for […]
1. Chemical Backbone of Thermal Silicone Thermally conductive silicone is based on polysiloxane (–Si–O–Si–). Each Si atom alternates with O atoms, forming the “Si–O backbone.” The Si atoms are typically bonded to methyl groups (–CH₃) or other functional groups. Basic structure: –Si(CH₃)₂–O–Si(CH₃)₂–O– 2. Bond Angles (Bond Foot) in Si–O–Si In this structure: Si atoms adopt […]
1. Definition of Electronegativity Electronegativity is the ability of an atom to attract shared electrons in a chemical bond. A higher value means the atom is more “greedy” for electrons. The most common scale is the Pauling scale. 2. Periodic Table Trends Electronegativity follows clear trends across the periodic table: Increases from left to right […]



